• Very Fast Wetting
• Compatible with HASL, Immersion Silver, ENIG, and OSP surface finishes
• Clear residue
• Compatible with Pb-free and SnPb alloys

CW-219 Highly-Activated Rosin Flux is designed for soldering to very oxidized copper, nickel, brass, bronze, zinc coatings, tin-plated steel, and similar surfaces. Customers prefer CW-219 for non-sensitive applications where they would like to increase the speed of wetting to achieve higher throughput. CW-219 has been confirmed to meet the requirements of J-STD-004 and J-STD-004B type ROM1.

CW-219 No-Clean Flux-Cored Solder Wire

Indium Corporation has developed a range of no-clean flux-cored solder wire solutions to meet the needs of virtually every assembly and rework operation. Cored wire solder formulas have evolved over time, but Indium Corporation’s new line of flux-cored solder wire goes back to the basics by adapting simple and traditional cored wire fluxes to address today’s assembly needs. Additionally, this new line of flux-cored solder wire has reduced spattering when compared to other formulas.

CW-219 Highly-Activated Rosin Flux is designed for soldering to very oxidized copper, nickel, brass, bronze, zinc coatings, tin-plated steel, and similar surfaces. Customers prefer CW-219 for non-sensitive applications where they would like to increase the speed of wetting to achieve higher throughput. CW-219 has been confirmed to meet the requirements of J-STD-004 and J-STD-004B type ROM1.

Process Recommendations

• Match the tip size to the part to be soldered
• Apply the solder wire to the joint, not to the soldering iron tip
• Use the lowest temperature possible
• 610–700°F (320–370°C) for SnPb and Pb-free
• Surface mount (SMT) soldering should be completed in 1–2 seconds
• Plated through-hole (PTH) soldering should be completed in 0.5–7.0seconds
• The robotic soldering process set-up is highly customizable anddepends on the assembly being soldered
• A smooth solder joint appearance requires the correct amount of temperature and time; fine-tuning the process parameters may be required to achieve the best possible outcome
• During robotic soldering, flux build-up and charring may occur; to avoid build-up, increase the iron tip cleaning frequency or reduce the iron tip temperature

CW-219 flux residue is non-corrosive; however, some applications require the removal of flux residues for cosmetic, reliability, or secondary operations. The residue can be removed with most solvents and saponifiers.