
$EACH
Multiples of: 30
Next Day Air Only
Has Expiration Date
- Description
- Specifications
- Excellent wetting
- Extended cleaning window
- Superior slump resistance
- Large process window
- Aqueous wash with water
- J-STD-004 ORM1
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life.
Brand:Â AIM Solder
Alloy:Â SAC305
Flux Type:Â Water Soluble
Lead Free:Â Yes
Powder Mesh Size:Â T4
Metal %:Â 88.5 %
Package Type:Â Jar
Series:Â WS488 Series
Alternate Product Number:Â 21602-07-00
Composition:Â 96.5% Tin, 3% Silver, 0.5% Copper
Container Type:Â 500g Jar
Shelf Life:Â 180 days
Type:Â Solder Paste
Viscosity:Â 600-1000 Kcps Typical
Water Soluble:Â Yes
$EACH
Multiples of: 30