Advanced Thermal Solutions ATS-NVP-3725-C1-R0 - Transfer Thermal Plate

Advanced Thermal Solutions, Inc is excited to launch our latest cooling solutions supporting the NVIDIA Jetson family of SOMs (System on Module). Today’s release of Thermal Transfer Plates (TTP) expands upon our existing cooling solutions for NVIDIA Jetson SOMs to address unique or challenging mechanical design constraints, thermal performance requirements, and integration needs.

Features & Benefits of the ATS Thermal Transfer Plates for NVIDIA Jetson

• Designed to fit NVIDIA Jetson modules that don’t come with an integrated thermal transfer plate.

• Can be integrated into a custom chassis or paired with additional thermal products to enhance cooling performance.

• Provided with leaf spring and screws for mounting to Jetson module.

• Pre-assembled with Thermal Interface Material (TIM) on base.

• Provided extra M3 mounting holes.

• For Jetson Xavier NX module.

Why use a Thermal Transfer Plate instead of a traditional Heatsink? Here are just a few reasons:

1. Integration into Custom Thermal Solutions - Thermal transfer plates act as intermediaries, allowing heat to be moved from the SOM to a custom cooling solution such as:

   • A chassis wall that acts as a passive heatsink

   • A heat pipe or vapor chamber

   • A fan-cooled enclosure

2. Rugged and Sealed Environments

   • In environments like industrial, automotive, or outdoor deployments, you often want the system to be fully sealed.

   • A heatsink with fins exposed to the air won't work in these cases, but a thermal transfer plate can conduct heat to the enclosure itself, which then dissipates it.

3. Better Mechanical Integration - Some designs mount the Jetson module upside down or vertically, making traditional heatsink attachment impractical. A thermal transfer plate provides a low-profile, flat interface that allows:

   • Mounting to a structural part of the device

   • Alignment with other thermal interfaces

   • Integration with system-level cooling (e.g., in drones or compact robots)

4. Size and Weight Constraints

   • In weight-sensitive applications (e.g., drones), bulky heatsinks may be avoided.

   • A thin thermal transfer plate with remote heat dissipation (e.g., via a heat pipe to a fined radiator) offers better performance-to-weight ratio.

Potential Customer Applications:

Since this product family was designed specifically for use with the NVIDIA Jetson SOMs, you’ll find opportunities for ATS in the same applications where you find the NVIDIA devices.

• Industrial Automation & Robotics

• Autonomous Vehicles

• Smart Cameras & Video Analytics

• Smart Cities & Infrastructure

• AIoT (AI + IoT) Devices

• Healthcare & Medical Devices

• Retail & Customer Experience

• AR/VR & Human-Machine Interaction

• Agriculture & Environmental Monitoring

• Defense & Security