• Good 0.0060 Ω·cm electrical resistivity and 0.95 W/(m·K) thermal conductivity
• Easy 1:1 mix ratio and long working time
• May be mixed once and then used as a 1-part epoxy for a four hour production shift
• Optimal cure temperature of only 65 °C
• Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
• Room temperature cure is possible (96 hours)
• Excellent adhesion to most electronic substrates

The 8331S Silver Conductive Epoxy Adhesive: Slow Cure is an economical electronic grade epoxy that combines long working time and good conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4–5 hours pot life, which once mixed behaves essentially like a 1-part adhesive for the duration of a work shift. However, unlike 1-part adhesives that often require high heat (130–170 °C), it will cure at 65 °C in less than 2 hours. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies; resists thermal and mechanical shocks; and provides the low resistivity needed for many operating conditions. The 8331S epoxy adhesive is great for forming conductivity seals, bonding, and repairing of electronic devices.