High-Density Modular Test Platform Mainframe, MP5000 Series

Specifications:

• Form Factor: 1U rack-mountable chassis

• Module Slots: 3 rear-access slots

• Channel Density: Up to 6 channels per chassis (2 channels per module)

• Scalability: Up to 32 mainframes via TSP-Link

• Digital I/O: 18 pins for hardware handshaking

• Interfaces: USB 3.0, 1 Gigabit Ethernet

• Web Interface: Built-in, browser-based control and monitoring

• Software Support: Python, LabVIEW, IVI, SCPI-compatible via TSP

TSP Toolkit:

• Visual Studio Code-based IDE

• On-instrument script debugging

• Automated TSP script generation with channel sync

• Python API integration

Key Features:

Modular Architecture

• Compact 1U mainframe offering significant space and cost efficiency over conventional rack-and-stack systems

• 3 configurable slots offer flexibility to mix & match PSU and SMU modules to optimize the cost-performance tradeoff

• Add or remove modules effortlessly without powering off the mainframe, thus reducing downtime

• Additional digital I/O pins (18) support efficient handshaking with other test rack equipment

• TSP-Link facilitates precise synchronization within 500 ns across multiple mainframes, ideal for high channel count parallel testing

• Employs 1Gbps Ethernet and USB 3.0 for fast data streaming

• Features a modern touch display for simplified setup and troubleshooting

The MP5000 Series is Tektronix’s next-generation modular precision test platform engineered to meet the evolving demands of automated test equipment (ATE) in validation and production workflows. Designed with a compact 1U form factor that supports up to six SMU or PSU channels per chassis and scales to 192 channels in parallel, native Python drivers, and the intuitive TSP Toolkit IDE, it delivers unmatched flexibility, performance, and automation for semiconductor, optoelectronics, and mission-critical applications.

This top-tier automated test equipment (ATE) optimizes rack space by incorporating multiple source measure units (SMUs) and power supplies with adaptable module options. Featuring three slots and dual-channel modules, it offers up to six parallel channels. For higher channel count applications, TSP-Link™ provides a solution to connect mainframes in a master-subordinate configuration, effectively allowing them to function as one unit. This facilitates the creation of an optimized source and measurement system suitable for a wide range of applications, from validating design and debugging to complex parallel test system used in ATE.

Customers can mix and match module configurations to optimize cost, throughput, and accuracy. For applications where low current measurements and sinking capabilities aren't required, power supplies can be a cost-effective solution. For applications in which true current sourcing and high-speed measurements are required, consider an SMU module. The system supports a wide array of applications, and its high-density design conserves valuable rack space and reduces cost per channel. It's engineered to deliver fast throughput for high-channel parallel testing, saving both cost and time for production and validation test users.

Software
INTUITIVE, INTERACTIVE, INTERFACE

• Intuitive Web Interface: A highly visual, interactive Web UI display designed for troubleshooting multi-channel setups and remote instrument monitoring

• TSP Toolkit: Facilitates the development of Test Script Processor (TSP™) scripts for automation within the widely-used Microsoft Visual Studio Code (VS Code) editor. More information and downloads found on the TSP Toolkit Product Page

• Supporting Drivers: Accelerate software development with drivers such as Python and IVI

In The Box

• MP5103 1U Modular Mainframe

• 4299-15: Fixed 1U Rack Mount Kit

• 174745900: Digital I/O, 30 position rectangular socket to wire

• CS-1616-3: Safety Interlock Connector

• CA-179-2A: CAT5E, RJ-45 LAN cable, 10 ft

• CA-568-120A: Grounding cable, 120 in.

• 174751000: USB-C Male to Male, Non Locking

• Power Cord (region-specific)

• Quick Start Guide / Safety Manual

• Web Interface Access Instructions

Software & Drivers:

• TSP Toolkit (Base Version) – Visual Studio Code-based IDE

• Python & IVI Drivers

• Utilize TSP commands

• Access to Online Documentation and Example Scripts