
$1,140.00KIT
Condition:NEW
- Description
- Specifications
To provide heat transfer between electrical/electronic components and their heat sinks. Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material.
- Cure may be heat accelerated
- 15:1 Mix Ratio (Part A: Part B)
Brand:Ā Nusil Technology
Alternate Product Number:Ā R-2930
Cure Time:Ā 30 min.
Specific Gravity:Ā 1.55
Tensile Strength:Ā 260 psi
$1,140.00KIT
