• High Tg
• Low CTE
• Reworkable
• Halogen free
• One component
• Room temperature flow capability
• Fast cure at moderate temperatures
• Compatible with most Pb-free solders
• Stable electrical performance in temperature humidity bias

LOCTITE ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other component. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.