• Ribbon bonding wedge for gold and aluminum wire
• Vertical feed - offers solution in maintaining maximum looping and tail control
• Front/Back radius: .0005 x .0005
• Foot type: Cross groove
• Ribbon size: 1x .003
• Bond length: .0030
• Foot finish: Matte (FR, BR & Bond flat)
• A2 Side Chamfer W .0045, A4 Front Step, A9 Back Chamber MAX

DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.