TestEquity

Save 10% when you spend $500+ on solder wire & bar. Code: SOLDER10. Online only. Ends 2/27.

ALPHA

ALPHA 249742.0033GM Capillary Underfill, CU13-3150, Thermal Cure, EFD Syringe, 33 gram, 30cc

Our Part #10020429

Mfr Part #249742.0033GM

ALPHA 249742.0033GM
ALPHA

ALPHA 249742.0033GM Capillary Underfill, CU13-3150, Thermal Cure, EFD Syringe, 33 gram, 30cc

Our Part #10020429

Condition:New

Mfr Part #249742.0033GM

Requires Dry Ice
WARNING
Has Expiration Date
RoHS
$44.92EACH
Multiples of: 12

Condition:New

Requires Dry Ice
Calif. Prop 65
Has Expiration Date
RoHS
  • Low temperature thermal cure underfill
  • Low Viscosity due to no filler
  • Fast Cure at Low Temperatures
  • Excellent adhesion and Drop Shock performance
  • Anhydride Free
  • NON-REWORKABLE

ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill designed for lower temperature applications for thermally sensitive parts. ALPHA HiTech CU13-3150 does not contain any fillers. Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.

Brand:Ā ALPHA
Alternate Product Number:Ā CU13-3150, 249742-0033GM-1998
Viscosity:Ā 3000 cP
Storage Temperature: ≤-20°C
Cure Time: ≤30 min.
Series:Ā CU31-3050 Series
Shelf Life:Ā 183 days
$44.92EACH
Multiples of: 12