ALPHA 249742.0033GM Capillary Underfill, CU13-3150, Thermal Cure, EFD Syringe, 33 gram, 30cc

• Low temperature thermal cure underfill
• Low Viscosity due to no filler
• Fast Cure at Low Temperatures
• Excellent adhesion and Drop Shock performance
• Anhydride Free
• NON-REWORKABLE

ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill designed for lower temperature applications for thermally sensitive parts. ALPHA HiTech CU13-3150 does not contain any fillers. Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.