• Suitable for pin grid array and standard ball grid array applications
• Airless packaging
• Excellent solderability to all common surface metallizations
• No-clean residue
• Can be used for printing, dipping, and pin transfer deposition
• Offers high yields in BGA bumping process
• Suitable for both Pb-free or SnPb applications

NC-506 Ball-Attach Flux is a low-viscosity thixotropic no-clean flux designed for use in ball-attachment to substrates (BGA manufacturing). It is especially useful in applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball-attach flux is needed, and is suitable for a variety of different deposition methods.