• REL0 flux classification
• Optimized for Lead-free and standard alloy systems
• Wide process window
• Residue can be left on the board in most assemblies (not recommended for high impedance assemblies)
• Excellent wetting compatibility on most board finishes
• Low voiding, Including LGA
• REACH compliant

AMTECH tacky fluxes are designed to complement our entire product line, including no-clean, water washable, and RMA formulations. Our advanced chemistries can be used for general touch-up and rework, attaching spheres to microelectronic packages, and soldering Flip Chip components to various PCB substrates.

Application

4300/LF-4300-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. 4300/LF-4300-TF may be used for BGA sphere attachment and reballing. 4300/LF-4300-TF is also designed to work on all flip chip bumping and chip scale packaging sites.