• Solvent-free
• Easy moldability
• Excellent environmental resistance
• Very short open time
• Operating temperature: -40°F to 437°F

TECHNOMELT® PA 673 N is a one-component industrial grade Polyamide Hot Melt Adhesive designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage.
Once applied TECHNOMELT® PA 673 N solidifies to form a barrier between electronics and the environment. It is a resilient encapsulant with good heat stability and moisture resistance. Typical applications include potting electronics modules, molding strain relief into wiring and encapsulation of sensors. It is a versatile adhesive providing a good balance of low and high temperature performance.