• Halogen-free per J-STD-004B. To be halogen-free per J-STD-004B, the formula must contain less than 500ppm of any kind of halogen, ionic or nonionically bonded chlorine, bromine, or fluorine. This is new to J-STD-004B since fluxes that conform to the original J-STD-004 or J-STD-004A may still contain halogens that only disassociate at soldering temperatures, but leave a residue that contains ionic halogen.
• Light-colored, low-residue, and rosin-containing flux for better performance on large and thick circuit boards. Rosin, modified rosins, and resins contribute to enhanced heat stability for thick or difficult-to-solder boards and for the encapsulation of flux activators. However, in some cases, rosins and resins may interfere with electronic probe-testability.
• Compatible with Hot Air Solder Leveled (HASL), Immersion Silver, Electroless Nickel Immersion Gold (ENIG), and Organically Solder Preserved (OSP) Copper surfaces.
• For use with all common lead-free and tin-lead alloys, including: SAC305; SAC105; SAC0307; silver-free tin-copper plus additive alloys, such as Indium Corporation’s Sn995; 96.5Sn/3.5Ag; 63Sn/37Pb; 60Sn/40Pb; and many others.

WF-9945 is a halogen-free no-clean flux developed for wave soldering mixed-technology and through-hole electronics assemblies. WF-9945 is formulated to provide excellent wetting and superior hole-fill under a wide variety of conditions. When compared to Indium Corporation’s halogen-free WF-9955, WF-9945 contains more rosin, which increases heat stability and widens the effective heat profiles, allowing for very high yield when wave soldering larger, thicker, and more complex circuit boards. The trade-off is slightly more visible residue and in some cases, changes required to electronic probe testing procedures. WF-9945 is designed for use with tin-copper, tin-silver-copper, and tin-lead alloys.