Requires Dry Ice
Calif. Prop 65
- Description
- Specifications
- Documents
- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill designed for lower temperature applications for thermally sensitive parts. ALPHA HiTech CU13-3150 does not contain any fillers. Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.
Brand:Â ALPHA
Alternate Product Number:Â CU13-3150, 249742-0011GM-1998
Series:Â CU13-3050 Series